Electromigration
 |
| SEM micrograph showing voids and hillocks |
At the high current densities typical in thin-film conductors on integrated circuits, there is significant momentum transfer from the electrons to the atoms. The microstructure of the metallization leads to the consequent atomic flow being non-uniform, and damage results in the form of voids or hillocks. Our work focuses on the interactions of microstructure, electromigration damage and failure.
TEM micrographs of in-situ test showing voiding
If you have any comments or suggestions, please contact the webmaster (Rob Cork)